Chemicals For Electronic Components
What are electronic component chemicals?
Chemicals for electronic components are used in everyday life
Flexible base
Contact
Plating for joints
External interface
Exterior
Joint plating
Semiconductor
Exterior plating
Connector
Contact
Joint plating
Plating line process
This shows each plating line process.
Hoop (continuous) plating line process
- Dipping degreasing
- Electrolytic degreasing
- Electrolytic machining
- Ni plating
- Plating
- Aftertreatment
Semiconductor rack and rackless plating line process
- Dipping degreasing
- Electrolytic deburring
- Electrolytic machining
- Plating
- Aftertreatment
Sn plating process (Metasu FSM series)
Sn plating for connectors (Metasu FSM-07)
Features
- Produces a uniform matte appearance independent of current density.
- Good solder wettability and whisker characteristics are achieved.
- Can also be used for reflow Sn specifications.
- Excellent bath stability due to running.
Metasu FSM-07 solder wettability of plating film
The plating film of Metasu FSM-07 is formed with much less degradation of solder wettability compared to the conventional matte Sn plating film.
Sn plating for semiconductors (Metasu FSM series)
Features
- The plating chemicals are used in the semiconductor market.
- Uniform crystals can be achieved over a wide range of current densities.
- Excellent solder wettability and thermal fatigue properties.
Crystal formation performed under different current densities
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5ASD
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10ASD
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30ASD
Magnified images of crystals processed at current densities from 5 to 30 ASD. It can be seen that uniform crystals are formed at all current densities.
New aftertreatment agent
Au plating sealant (Metasu HS-15P)
Features
- Excellent corrosion resistance to corrosive environments (nitric acid exposure)
- No increase in contact resistance or decrease in solder wettability after treatment
- No emulsion type, without staining or unevenness
Corrosion resistance
Various types of corrosion resistance are greatly improved by sealing treatment
Contact resistance
No change in contact resistance after Metasu HS-15P treatment
Anti-degradation agent for Sn plating solder wettability (Metasu HB-15)
Features
- Prevents degradation of solder wettability due to aging of Sn and Sn alloy plating film.
- No stains/unevenness after treatment.
- It does not affect Au or Ni plated films other than Sn plated films.
Solder wettability
Degradation of solder wettability is prevented even after PCT.
Prevention mechanism
By dipping treatment, an organic + inorganic film is formed.
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